专业主机前盖包覆加工，采用无缝高温导热带传热贴合工艺，导热柔和，加工过程不会刮花、灼伤壳体基材。设备箱式上下均匀恒温加热，壳体与面料受热一致，贴合平整服帖，无气泡、翘边、开胶缺陷。适配各类数码设备主机
More options within the same process family — custom production from your drawings or samples.
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